Electroplating Processes
Optimisation of new and existing electroplating processes can offer significant improvements in product quality and operational costs, especially through adaptation of the cell configuration (electrode positioning) or process conditions such as flow rates and sparger positioning.
The most efficient route to accomplish rigorous process optimisation is the use of simulation tools. Depending on the nature of the problem, we offer several approaches involving the simulation of current and potential distributions in combination with computational fluid dynamics.
In most cases the process can be optimised through adaptation of the cell geometry using primary current and potential distribution simulation results. For more complex cases the simulation of current and potential distributions can be refined, taking detailed hydrodynamics into account.
